n i chia st s-da1- 1379a nichia corporation specifications for white led NJSW172T pb-f r e e r e f l o w so lder ing a ppli c at io n b u ilt -i n e s d p r ot ec ti on d e vi c e r o hs co mp lia nt http://
n i chia st s-da1- 1379a 1 specifica t ions (1) ab sol u te maxi mum r a ti ngs item symbol absolute maximum rating unit f o rw ard current i f 450 ma pulse f o rw ard current i fp 900 ma al l o w a b l e r e v e rse current i r 85 ma po w e r d i s s i p a t i o n p d 1. 64 w oper ati n g t e m p er ature t op r - 40~100 c stor age t e mper ature t st g - 40~100 c jun c t i on t e mp er ature t j 150 c * abs o l u te maxi mum r a t i ngs at t s =25c. * i fp co ndit io n s wi th pu ls e wi dth 1 0 m s an d dut y cycl e 10%. ( 2 ) in it ial e l ect r ical/ o pt i cal c h ar acterist ics ite m symbol condition typ unit forward voltage v f i f =350ma 3.3 v luminous flux v i f =350ma 100 lm x - i f =350ma 0.31 - chroma ticit y c oordinate y - i f =350ma 0.32 - * char acteristics at t s =25c . * lum i nous f l ux v a l u e as p e r cie 127: 200 7 s t andard . * chrom a t i ci t y coordi nate s as pe r cie 1931 chrom a ti cit y chart .
n i chia st s-da1- 1379a 2 ranks item rank min max unit forward voltage - 2. 70 3. 65 v p19 121. 1 144.0 p18 101. 8 121.1 p17 85. 6 101.8 luminous flux p16 72. 0 85.6 lm color r a nks ra n k b 3 rank b4 x 0. 287 0. 283 0. 304 0. 307 x 0. 307 0. 304 0. 330 0.330 y 0. 295 0. 305 0. 330 0. 315 y 0. 315 0. 330 0. 360 0.339 ra n k b 5 rank b6 x 0. 296 0. 287 0. 307 0. 311 x 0. 311 0. 307 0. 330 0.330 y 0. 276 0. 295 0. 315 0. 294 y 0. 294 0. 315 0. 339 0.318 ra n k c 1 rank c2 x 0. 330 0. 330 0. 361 0. 357 x 0. 330 0. 330 0. 357 0.356 y 0. 339 0. 360 0. 385 0. 361 y 0. 318 0. 339 0. 361 0.351 * r a nking at t s =25c. * t o ler a nce of mea s ure m e n t s of the f o rward v o ltage is 0 .0 5 v . * t o ler a nce of mea s ure m e n t s of the l u m i n o us f l ux is 7 %. * t o ler a nce of mea s ure m e n t s of the c h romaticit y coordinate is 0.01. * a shipm en t shal l co ns is t o f led s in a co m b ina t io n o f the above r a nk s. the per c en t a ge o f each r a nk in the sh ip men t s h al l be deter m ined by ni ch ia.
n i chia st s-da1- 1379a 3 chroma ticity d i agram b3 c1 b5 b4 b6 c2 0.20 0.25 0.30 0.35 0.40 0.45 0.2 0 0.25 0 .30 0 .35 0 .40 0.4 5 x y
n i chia st s-da1- 1379a 4 outline dimensions sts- da7- 0459a n j sx172 no. ( g un it: mm) t h is p r o d uc t co m p li es wi th ro hs d i re cti v e. u ? ro hs ? m ?? * ( g un it : mm, to le r a n c e : 0 . 2 ) 0.5 2.7 2.7 1 ca t h o d e anode 0.8 (2.3) 3 3 (2 .3 ) ca t h o d e ma r k ka o protection device ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ?? ceramics ?`? ? + w? silicone resin (with diffuser and phosphor) ? au-plated 0.024g ( t y p )
n i chia st s-da1- 1379a 5 soldering ? r e co mm end e d r e f l ow sold ering co ndi t io n ( lead -free sol d er) ? r e co mm end e d hand so lde r ing co nd it io n temperature 350c max soldering time 3sec max ? r e co mmend e d sold ering p a d p a ttern ( g unit: mm) 3 0.5 3.6 * thi s led is desi gned to be refl ow so l dered on to a pc b . if di p s olde r e d , n i c h i a c a nnot guar ant e e it s r e li abili t y . * r e fl ow so l d eri n g must not be perform ed more than twice. hand sol d ering mu st not b e performed more than o n ce. * a v oid r a pid cooling. r a mp down th e temp er ature gr adua lly from th e pe ak tem p er at ure. * n i t rogen ref l ow soldering is reco mmend e d. ai r fl ow sold ering cond it ion s can caus e op ti cal d e gr adat i o n, caused by h e at and / or atmospher e . * since the si l i con e us ed i n t h e en cap s ul at i n g res i n is sof t , do not pre ss on the en caps ulan t re si n. pressure ca n cau s e n i ck s, chip -ou t s , en c a psu l an t de la mi nat i on and deformati o n, and wi re br eak s , decrea si ng re li abil i t y . * r e pairing should not be d o ne after th e l e ds ha v e been solder ed. wh en repair ing is u n a v oidable, a do uble-h e a d so lder ing ir o n sho u ld be u s ed. it shoul d b e confi r med b e forehand wh et h e r th e char ac te rist i cs of th e l ed s wi ll or w i ll not be da maged by repairing . * when sold ering, do not ap ply str e s s to t h e le d whi l e th e le d is ho t . 120sec max pre- hea t 180 t o 200c 260c max 10sec max 60sec max above 220c 1 t o 5c pe r se c
n i chia st s-da1- 1379a 6 t a pe and reel dimensions sts- da7- 0064a quant i t y pe r r e el =4000 pcs 1 `? 4000 ? * nxxx172x ` ??? tap e 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 -0 1. 5 +0 .1 8 +0.3 -0.1 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? label 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0.3 60 +1 -0 180 +0 -3 th e t a pe packin g me t h o d c o mp lie s w i t h j i s c 0806 (p ack a ging of ele c tronic co mpo n e n ts o n co nt inuous t a pes ) . * j i s c 0806 ?? ?` ?? ? no . ( g unit: mm) 3.3 0.1 0.2 0.05 1.05 0.1 3.3 0.1 cathode mark -0 1 +0 . 2 5 ?` / ` trailer and leader t o p c o v e r t a pe led ? ` min 400mm ? ` min 160mm ? t r ai ler 1 6 0 mm min (em p ty po cke t s) lo aded po ckets ? ? ` em bo ss ed c a rr i e r t a pe ?? ` ?` f eed dir e ct ion lea d er wi th o u t t o p co v e r t a pe 4 0 0 m m mi n min 100mm lea d er with to p cov e r ta p e 100mm m i n ( empt y pocke t )
n i chia st s-da1- 1379a 7 p a ckaging - t a pe & reel nichia led sts-da7-0006b n x xxxxxx ? label la b e l no . reel ` ?` sea l mo isture-proo f bag ? ? for details, see "lot numbering scheme" in this document. * ? ? ???? ? ? if not provide d , it is n o t ind i cat e d on t h e l a b e l . ******* is t h e cus t o m e r p a r t n u mbe r . O ? ? ? ? * ******* ? the l a b e l does no t have the r a n k fi el d fo r u n - r a n k e d pr o d u c ts. * ? ? ? ? ro h s nxxx xx xx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan typ e lot qty. ym xx xx -rrr pcs rohs nxx xxx xx xxxx led ** *** ** rr r pcs typ e ra nk qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-sealed moisture-proof bags. ` ? ` de sic c an t s pr o d ucts sh ipp e d o n tape a n d r eel a r e p a ck ed i n a moistu re-proo f bag. t h ey a r e shipp e d in card bo ard bo xes to p r otect th em fr o m exter n al f o rces duri ng transp o r ta ti o n . ? \ H? y ? B ? ? y * ?` ? ? ? y ? ? * ? Q H n ? u? p ? ? ? ? * * u ? ?` ? n ? g o ?` y ? usin g an orig inal packagi n g mat e rial or eq uivale nt in t r ans i t is r e co m m en de d. d o no t ex po se to wa ter, the bo x is no t water-resi s t ant. do not drop o r sho c k the box. i t may dama g e th e pr o d ucts. m o is tu re -pr o o f ba gs a r e pa ck e d in c a r d bo a r d bo x e s w i th c o r r u ga ted pa rti t i o n s . ? K ? ` ?
n i chia st s-da1- 1379a 8 l o t numbering scheme lot numb er is presented by using t h e foll owing al phanum e r i c c o de . ymxxxx - r r r y - y e a r year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - m o n t h mont h m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx - n i c hi a's product n u mber rrr -r ank i ng by color c oordi nat e s , r a nking by lu m i nous flux
n i chia st s-da1- 1379a 9 dera ting characteristics nj s x 1 7 2 s t s - d a 7- 045 5a no . der a t i n g 1 0 10 0 20 0 30 0 40 0 50 0 0 2 0 4 06 08 0 1 0 0 1 2 0 ( 63, 4 50) ( 100 , 261 ) de ra t i n g 2 0 10 0 20 0 30 0 40 0 50 0 0 20 4 0 60 80 100 12 0 ( 1 00, 4 50) du t y 10 100 10 0 0 1 1 0 100 450 900 S allowable forward current ( ma ) `??????-S solder temperature(c athode side) vs allowable forward current ? ?- S a m b i en t t e m p e r a t u r e v s a l l o w a ble f o r w a r d c u r r e n t S al l o w a b l e f o r w a r d c u r r e n t ( m a ) S a l l o w a b l e f o rw a r d c u rr e n t ( ma ) ` s o l d er t em p er a t u r e( cath o d e s i d e) ( c ) ?? a m b i en t t e m p er a tu r e ( c ) ? ` ` du t y r a ti o ( % ) ` ` - S d u ty r a ti o v s a llo w a ble f o r w a r d c u r r e n t t a =2 5 c 55 c/w ja r =
n i chia st s-da1- 1379a 10 optical characteristics nj s w 1 7 2 no . s t s - d a 7 - 0 4 5 6 sp e c tr u m 0.0 0. 2 0. 4 0. 6 0. 8 1. 0 350 4 0 0 4 5 0 500 55 0 6 00 650 70 0 7 5 0 r e la t i v e i l lu m i n a n c e ( a . u . ) di r e c t i v i t y 1 90 80 70 60 50 40 30 20 10 0 -1 0 -2 0 -3 0 -4 0 -5 0 -6 0 -7 0 -8 0 -9 0 k sp e c t r um k? r e la t i v e e m is s i o n i n t e n s i t y ( a . u . ) L wave l e n g th ( n m ) ? d ir e c t iv it y ? ra d i a t i o n a n g l e 10 . 5 0 0 . 5 1 * ?? a l l ch a r act e r i st i c s sh ow n a r e for r e fe re n c e on l y a n d ar e n o t g u ara n t e e d . 350 m a i fp = t a =2 5 c 35 0m a i fp = t a =2 5 c
n i chia st s-da1- 1379a 11 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics nj s w 1 7 2 s t s - d a 7-04 57 no . tavf 2. 0 2. 5 3. 0 3. 5 4. 0 4. 5 - 60 - 40 - 2 0 0 2 0 4 0 60 80 10 0 120 ta iv 0. 6 0. 8 1. 0 1. 2 1. 4 - 60 - 40 - 2 0 0 2 0 4 0 60 80 1 00 12 0 vf i f 10 10 0 10 0 0 2 . 02 . 53 . 03 . 5 4 . 04 . 5 35 0 90 0 relative luminous flux(a.u.) ??- am b i e n t te m p e r a t u r e v s r e l a t i v e l u m i no us f l u x for ward curren t( ma) ifiv 0. 0 0. 5 1. 0 1. 5 2. 0 2. 5 3. 0 0 2 00 4 0 0 600 800 1 00 0 r e l a ti v e l u m i n o u s fl u x ( a . u . ) - fo r w a r d c u r r e n t v s r e l a t i v e l u m i no us f l u x f o r w a r d c u rre n t ( m a ) R- fo r w a r d v o l t a g e v s fo r w a r d c u r r e n t ? - R a m b i en t t e m p e r a t u r e v s fo r w a r d v o l t a g e ?R fo r w a r d v o l t a g e ( v ) ?R f orward voltage(v) ?? am b i en t t em p e r atu r e( c) ?? am bi ent t e m p erature ( c ) t a =2 5 c * ?? a l l c h ar ac t e r i s t i c s s h o w n a r e f o r r e f e r e n c e o n l y a n d a r e n o t g u ar a n t eed . t a =2 5 c i fp = 350 ma i fp = 350 ma
n i chia st s-da1- 1379a 12 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics no . nj sw1 72 sts-da7-0458 taxy 0. 30 0. 31 0. 32 0. 33 0. 34 0. 2 9 0. 30 0. 31 0. 32 0. 33 -4 0 c 25 c 10 0c x ifxy 0. 30 0. 31 0. 32 0. 33 0. 34 0. 29 0. 30 0. 31 0. 32 0. 33 20 m a 10 0m a 350 m a 4 50m a 90 0m a x y y 3 50 m a i fp = ? - ? ambient temperature vs chromaticity coordinate - ? fo r w a r d c u r r e n t vs ch r o m a ti c i ty c o o r d i n a te t a =2 5 c * ? a l l c h a r ac t e r i st i c s sh ow n a r e f o r r e f e re n c e on l y a n d a r e n ot g u ar an t e ed .
n i chia st s-da1- 1379a 13 reliability (1) t e s t s a n d r e sults te s t reference standard test conditions te s t duration failure criteria # units failed/tested r e si st anc e t o soldering heat (reflow soldering) j e it a ed- 4701 300 30 1 t sl d =260c, 10 s e c, 2re f l o w s , pre c ondit i o n : 3 0 c, 70%r h , 168hr #1 0/22 sol derability (r eflow soldering) je it a ed- 4701 303 30 3a t sl d =2455c, 5s e c , le ad- f r e e sold e r ( s n- 3. 0ag - 0.5cu) #2 0/22 ther mal s hock jeit a ed- 4701 300 30 7 - 40c t o 100c, 1mi n dwell , 1 0 s ec tr an sfer , pre c ondit i o n : 3 0 c, 70%r h , 168hr 100c y c l e s #1 0/50 t e mper a t ure c y cle j e it a ed- 4701 100 10 5 - 40c( 30mi n )~25c( 5mi n )~ 100c( 30m i n )~25c( 5mi n ) 100c y c l e s #1 0/50 mois tur e r esistance (cycl i c ) jeita ed-4701 200 20 3 25c~65c~-10c, 90%r h , 24hr per cy cle 10c y c l e s #1 0/50 high t e mp erature stor age j e it a ed- 4701 200 20 1 t a =100c 1000hours #1 0/ 50 t e mper a t ure humidity stor age j e it a ed- 4701 100 10 3 t a =60c, r h = 90% 1000hours #1 0/ 50 low t e mp er atu r e stor age j e it a ed- 4701 200 20 2 t a =- 40c 1000hours #1 0/ 50 r oom t e mper a t ure oper at ing li f e t a =25c, i f =450m a t e st board : se e no tes b e low 1000hours #1 0/ 50 high te mp er at ure oper at ing li f e t a =100c, i f =250m a t e st board : se e no tes b e low 1000hours #1 0/ 50 te mper a t ure h u m i di t y oper at ing li f e 60c, r h =90 % , i f =350m a t e st board : se e no tes b e low 1000hours #1 0/ 50 low te mp er atu r e oper at ing li f e t a =- 40c, i f = 350m a t e st board : se e no tes b e low 1000hours #1 0/ 50 pe rma n ence of marki n g j e it a ed- 4701 500 50 1 is opropyl alc o hol , 235c , dipp ing time: 5min 1t im e #1 0/ 22 vibr ation j e it a ed- 4701 400 40 3 200m / s 2 , 100 ~2000~100hz , 4 c ycle s, 4 m i n , each x, y , z 48m i n ut es #1 0/ 10 ele c tro s ta ti c d i scharg es j e it a ed- 4701 300 30 4 hbm, 2kv , 1. 5 k ? , 100pf , 3pul se s, al te rn at el y posi ti v e or n e gat i ve #1 0/ 22 no tes: 1) test board: fr 4 board t h ic kne s s = 1.6m m, c o ppe r la y e r t h ic kne ss=0. 07m m, r ja 55c/ w 2 ) m e a s u r e m e n t s a r e p e rformed af ter al l o w i ng the led s to return to room temper a t ure. ( 2 ) f a ilu re c r it eria criteria # items conditions failure criteria f o rw ard v o ltag e(v f ) i f =350ma >initial value1.1 #1 luminous flux ( v ) i f =350m a n i chia st s-da1- 1379a 14 ca u t ion s (1) stor age conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date stor age after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product c o m p li es wit h j e d e c msl 3 or e q uiv a le nt . see ipc/j e d e c std - 020 for m o i s t u re- s e n s i t i v i t y det a il s. absorbed moi s ture i n led packages can v apori ze and expand during sol d ering, w h ich can ca use i n terface del a mi na ti on and result in optical p e rforman ce degr ad ation . prod ucts are pack ed in m o is ture - p roof al um inum bags to min i m i ze mo i s tur e abso rptio n d u ri ng t r anspo r ta tio n a n d sto r age . inc l ude d s ilic a ge l de si cc ant s change from bl ue t o re d i f m o is ture had pe net r at e d bags. after opening the moisture-proof alu m inu m bag, the pro d ucts should g o through th e solder ing pro c ess withi n th e r a nge of th e co ndi t ion s s t at ed above. un us e d rema in ing le ds shou ld be s t ored wi th si li c a gel de si cca nt s in a herm et ically sea l e d co nta i ner , preferab l y the ori g i n al mo i s ture-pr oof bags for stor age. after t h e ?p eriod aft e r op eni n g? s t or age ti me h a s be en exceed ed or s i l i ca ge l de si cca nts ar e no lo ng er blu e , the products shou ld be b a k e d. baking shoul d onl y be d o ne once. alt h ough th e lead s or el ec trode pads (an o de and ca tho d e) of th e prod uct ar e pla t ed wit h gold , prol onged exposure to a corrosi v e en v i ro nment mi ght cause th e gold plat ed t h e l e ad s or ele c trod e pads to tar n i s h , and thus le ading to dif f i cu lt ie s in so ld eri n g. if unu sed l e ds r e ma in , th e y mus t be sto r ed in a her m et i c al ly sea l e d co nta i ner . nich i a r e co mm end s us ing the or i g i n al moi s ture-proof bag for stor age. do not use s u lfur- c on tainin g ma terials in c o mm erc i al product s . som e m a ter i al s, su ch a s s e al s and adh e sives , may co nta i n su lfur . the conta m ina t ed p l at ing of leds m i gh t caus e an ope n circ uit. s i l i cone rubber is reco mmen d e d as a materi a l for seals. bear in m i n d , th e us e o f si li cone s may le ad to si l i con e c o nta m i n at ion o f ele c tr ica l co n t ac ts ins i de th e pr o d uc ts , caused by l o w mol e cu lar weig ht vo la ti le si lox a ne . t o prevent water cond en s a tion , p l eas e avoid large te m p er at ure a n d h u midit y fluctua t ion s for the stor age conditi o ns. (2) di recti o ns for use when desig n i n g a ci r c ui t, the curre n t thro ugh ea ch le d mu st no t exc e ed th e abso lu t e maxi mu m r a tin g . oper ati n g a t a co nstant current p e r led is reco mmen ded. in case of o p er ating at a c o nsta nt vo ltag e, c i rcu i t b is r ecom m ende d . if the led s are oper ated w i th con s ta nt vo ltag e us ing c i r c ui t a, th e curr ent thro ug h t h e le ds may v a ry due to t he v a riat io n in f o r w ar d v o ltage ch ar acteristics of t h e leds. (a) ... (b) .. . leds sho u l d be oper ated i n forw ard bi as. d r i v i n g ci rcuits must no t subj ect led s to either forw ard or rev e rse v o ltag e whil e off . continuo us reverse voltag e can caus e m i gr ation an d le d dam a ge. f o r s t abi l i z ing t h e led c h ar ac t e r i st ic s, it is re c o m m end e d to oper ate a t greater than 1 0 % nom i na l cu rrent . f o r outdoor use, necessary mea s ures sho u l d be tak e n to prevent wa ter , mo i s tur e and sal t air da mag e . (3) handl i n g precau ti ons do not hand le le d s with b a re hand s, it ma y con t a m in ate the l e d surface and affect opt i ca l char a c ter i s t i c s . in the worst case , ca tas t ro phic fa il ure fro m exce ss pr es su re throug h w i re-bond break s and packag e damage ma y r e su lt. when ha ndling t h e produ c t with t w ee z e r s , be ca reful not to appl y ex cess ive forc e to the r e s i n. otherwis e, the re si n can be cu t, ch ipped, delamina te or deform ed , causing w i re-bo n d breaks an d cata stroph ic fa ilures. dropping th e product ma y cause damage. do no t sta c k asse mb led p c bs to g e t h er . f a il ure to co mp l y can cau s e th e res i n po rt io n o f the pro d u c t to be c u t , ch ip ped, delaminated and/or defor m ed . it ma y cause w i re to break, lead i n g to catastrophi c f a i l ures.
n i chia st s-da1- 1379a 15 (4) desi gn consi d er ati o n pcb warpag e after mo un ti ng th e pro d uc t s o n to a pc b c a n cau s e the p a ck age to br ea k . the led s h ould be p l ac ed in a way to m i ni mize t h e s t re ss on the l ed s due to pc b bo w and tw is t. the positio n and orienta t io n of the leds affect how m u ch me cha n i c al stre ss i s exerte d on the leds pl aced near the score li nes. the led s h ould be p l ac ed in a way to m i ni mize t h e s t re ss on the l ed s due to board f l ex ing. board separ a ti on must b e performed us in g spec ia l j i g s , no t u s in g hand s. if an alu m in um pc b is used, cu sto m er is advised to v e rit y the pc b with th e products before use. thermal str e ss d uri ng us e can ca us e th e solder jo in ts to cr ack. (5) el ectrostati c di scha r ge (es d ) the produ c t s are se ns it ive to sta t ic e l e c tr i c i t y or surg e voltag e. es d ca n damag e a di e and i t s re l i ab il i t y . when handling t h e produ c ts , th e followin g mea s ure s ag ains t e l e c tro s t a ti c di sch arge are stron g ly re com m e n ded : e l i m i n a t i n g t h e c h a r g e grounded wri s t s t r ap , esd foot w e ar , clot hes, a n d fl oo rs grounded workstat ion equipm en t and tools esd tabl e/s h e l f ma t ma de of condu c t i ve ma ter i al s pr o p er gr o u nding is r e qu ir ed f o r all d e v i c e s, equ i pm en t, and mac h i n er y used in pr o d uct a s s e mb ly . surge prot ecti on should be consi d ered wh en desig n ing of commercia l products. if tools or e q uip m e n t co nt ain i n s u la ti ng mat e ria l s su ch as gla ss or pla s t i c , t h e fol l o wi ng m e as u r es agai n st el ec t r os t a ti c di sch arge are stron g ly re com m e n ded : diss ipat i n g sta t ic c h arg e wi th co nduc t i ve mat e ria l s preventi ng charg e gen e r a tio n w i th m o is ture n e u t r a l i z i n g t h e c h a r g e w i t h i o n i z e r s th e cu st ome r i s advi se d to c h ec k if the leds are da ma ged by esd when performing the char acter i stics i n sp ecti on of t h e led s i n the app l icati o n. d amage ca n be detected wi th a forw ard v o l t ag e mea s urement or a li g h t - up test a t l o w current ( 1m a ) . esd da mag e d led s ma y ha v e current fl o w at a l o w vo l t age o r no lo ng er il lu m i na te at a lo w cur r e nt . f a ilur e c r iter ia : v f <2.0 v at i f =0.5ma (6) t h ermal manageme nt proper th er mal manag e m e nt is a n i m po r t an t when designing prod ucts with le ds . le d di e t e mp er at ure i s affec t ed by pcb ther mal r e sistan ce and le d spa c ing on th e boar d. pl eas e de sig n produc ts in a way that t he l e d d i e t e mperature does not exceed th e max i mu m j unc t i on t e mper a t ure ( t j ). d r i v e current should be d e ter m i n ed for t h e s u rround ing ambi en t te mp er ature (t a ) to dis s ipa t e the h e at fro m the pr o d uct . the fol l owi n g equat i on s ca n be us ed to c a lcu l a t e the ju nct i on te mper a t ure of t h e pro d uct s . 1 ) t j =t a +r ja ? w 2 ) t j =t s +r js ? w * t j =led junc tio n te mp e r ature: c t a = a m b i e nt te mp e r a t ure : c t s =soldering te mper a t ure ( c at hode s i de) : c r ja =th e rma l resi stance from ju nc tio n to amb i e n t : c/w r js =therma l resi stance from juncti o n to t s measuring point 25c/ w w = i n p u t p o w e r ( i f v f ): w ts point
n i chia st s-da1- 1379a 16 (7) cl eani ng if r e quir ed, iso p r o py l a l co h o l (ip a ) s h o u l d be use d . o t he r solven ts may caus e pre m at ure fai l ure to t h e le ds due to the d a mage to th e r e si n port ion . t h e effe ct s of s u ch solve n t s s h ould b e v e ri f i ed pri o r to use. in additio n , the use of c f c s su ch as freo n is heavi l y re gula ted . ultr ason ic cleaning is no t recom m e nde d s i nc e i t may have adverse eff e ct s on t he l e ds depending on the ultr ason ic power a n d h o w led is assembled. if ultr asonic clea ning m u s t be use d , t h e c u sto m er is adv i se d to mak e sure the led s w i ll not b e da ma ged pri o r to cl eani ng . (8) ey e saf e t y in 2006, t h e inte rnat i o nal el ec t r i c al comm is si on (iec ) publi s he d iec 62471: 200 6 phot obi o l ogic a l s a fet y of l a m p s and lamp sy ste m s, wh ic h a dded le ds in it s scop e . on t h e ot her hand, t h e iec 60825- 1: 20 07 l a s e r s a f e t y s t andard r e mo v e d leds from it s sc ope. however , pl ease b e advi se d that som e co untr i es and regions ha v e ado p ted stand a rds bas e d on t h e iec l a s e r safe t y s t andard iec 60825- 1: 20 112001, whi c h s t ill i n cl udes leds i n i t s sc op e . most of n i chi a 's l e ds ca n be cl a s si fied as bel o ng ing in to either the ex empt group or risk group 1. hi gh- p owe r leds , t h at emit li gh t con t aining blu e w a vele ngth s, ma y be cla s s i fi ed as ri sk group 2 . please pro c eed wi th cau t io n whe n view in g direc t ly an y leds dri v en at hi gh current, o r vi ewing led s with opt i ca l ins t ru me nt s w h ic h may gr eat l y in crea se t h e damage s to your eyes . view ing a f l ashi ng l i gh t m a y caus e eye d i s c omfort . when in corpor ating the l e d i n to y o ur product, pl ease be careful to a v oi d adv e rse eff e cts on the hu man body caused by ligh t stimu l a t ion. (9) ot hers the le d s d e scr ibed in th is brochure ar e i n te nded to be used for ordina ry el ectroni c equi p m en t (such as offi ce eq uipment, commun i cat i ons equ i pm en t, mea s ure m e n t in str um e n t s and hou s eho l d applia nc es ). co nsult n i c h ia' s sal e s staf f in adv a n c e f o r inf o r m a t io n o n th e appl ica t i o ns i n wh ich e x ceptio na l qua l it y and r eliab i l i t y ar e r eq u ir ed , par t icu l ar ly when the f a il ure o r malf u n c t io n o f the le ds m a y direc t ly j eo p ardize lif e o r heal th (such as for ai rplanes, a e rospa c e, sub m ersi b l e repeaters, nucl e ar reactor co nt r o l sy s t e m , a u t o mobi le s, tr affi c contr o l equi p m ent, li fe su pport s y stem s an d s a fet y de vi ce s). the c u s t om er sha ll not reverse eng i ne er by disas s e m bl i n g or analys is of the le d s wit h out ha v i ng pr ior writt e n co ns ent from nich i a . w h en def e c t ive le ds are fou n d, t h e c u s t om er sh a ll inf o r m ni ch ia dir ec t ly bef o r e di sas s e m bl ing o r ana l y s is . both th e cu sto m ers a n d n i c hia w i ll agr ee on offici al s p ec ifi c at io ns of su pplied produc ts before a customer 's vo lume producti on . specificatio ns and app e ar ance subject to chang e for impro v ement w i tho u t noti ce.
|
